Laser Ball Jetting Machine ke mochini o ikatisang oa sequential laser soldering, o sebetsana le lisebelisoa tse fapaneng tse fapaneng tsa microelectronic, haholo-holo tse inehetseng bakeng sa li-module tsa khamera, li-sensor, libui tsa TWS le lisebelisoa tsa optical.
Sistimi e khona ho beha le ho tsamaisa libolo tsa solder tse bophara bo pakeng tsa 300 µm le 2000 µm, lebelo la soldering ke libolo tse 3 ~ 5 motsotsoana.
E sebetsa ho soldering ea bolo ea lihlahisoa tse kang Limojule tsa Khamera, BGA re-balling, li-wafers, lihlahisoa tsa optoelectronic, li-sensor, libui tsa TWS, FPC ho pcb e thata ... joalo-joalo.